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ContactThe company mainly develops technologies in intense pulsed light, Laser, RF, Vacuum cavitation, and Ultrasonic.
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ContactThe company mainly develops technologies in intense pulsed light, Laser, RF, Vacuum cavitation, and Ultrasonic.
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ContactThe company mainly develops technologies in intense pulsed light, Laser, RF, Vacuum cavitation, and Ultrasonic.
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ContactThe company mainly develops technologies in intense pulsed light, Laser, RF, Vacuum cavitation, and Ultrasonic.
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ContactThe company mainly develops technologies in intense pulsed light, Laser, RF, Vacuum cavitation, and Ultrasonic.
Language
简体中文
KHM-550B Four-side cutter
Output: 60 PCS/H
Chips removal system
PC control
Product Advantages
Output: 60 PCS/H
Chips removal system
PC control
Work table with intelligent position and vacuumed suction
Scoring saw automatically cuts according to workpiece thickness
Technical Parameter
| Model：KHM-550B | |
|---|---|
| Min. working size | 1800*300(mm) |
| (L*W)Max. working size | 3000*1100(mm) |
| Working thickness | 30-60mm(mm) |
| Main saw parameter | 3*5.5(kw) (Ø300*Ø30) |
| Scoring saw parameter | 3*1.5(kw)(Ø120*Ø22) |
| Max. moving speed | 40(m/min) |
| Servo power for crossbeam moving | 1.5(kw) |
| Vacuum sucker position | Servo positioning |
| Workpiece position | Centering |
| Working table height from ground | 960(mm) |
| Vacuum pump power | 5.5(kw) |
| OTY of dust outlet | Ø200*1 |
| Total power | 35.5(kw) |
| Machine weight | 3500(KG) |
| (L*W*H)Machine size | 5158L*2700W*2396H(mm) |
Related Products
Product Information
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Contact Information
No.81, Ruixiang Street,Huangpu District,Guangzhou
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